Chip on Board (COB) Toolkit Advanced Packaging Toolkit single- few-chip modules chip-onboard bare-die component ۾ϴ PADS® Layout ڵ Ű ð Ȯϰ ҽѵ帳ϴ.
COB Toolkit Advanced Packaging Toolkit die , wire bond , flip-chip ǿ report Ű ڵ óν ǰ ѵ帳ϴ.
Advanced Packaging Toolkit ߰ single chip package die flag ǿ 輱 ϴ. پ die, die flag route wizard tool Ÿ reuse ǵ ϴ.
COB Toolkit Advanced Packaging Toolkit ɵ ball grid arrays (BGAs), chip-scale packages (CSPs), multi-chip modules packages (MCM), COB ϰ ȭ ص帳ϴ.
Features:
- Cuts design time of substrates with bare-die components
- Chip-on-Board (COB)
- Single-chip packages
- Few- and multi-chip packages
- Die ڵȭ
- die flags power ring鿡 ڵ
- ڵȭ wire-bond fanout ־ ġ
- ū package ٿ帳ϴ.
- Wizard μ ּȭ
- Die, die flag, and wire-bond wizards
- GDSII/ASCII/DXF
